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DNA Analysis Chip

Design and manufacture the package, assembly and test processes for a one of the first large scale DNA analysis chips.
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Au Flip Chip & TSV Interposer

Design the package and assembly process to produce components for a SiGe chips in a phased array antenna system.
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An Optical MEMS Device for Projection Displays

Design and manufacture the package, assembly process and test protocols for a Grating Light Valve based 64M display.
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Integrated Silicon Automotive Accelerometer (ISAAC)

Design and manufacture a MEMS accelerometer for automotive applications.
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Secure Micro SD Card

Develop the materials and assembly process a secure Micro SD Card for government and financial services applications.
Read the detailed case study here.