PACKAGE & PRODUCT DEVELOPMENT

Aspen Microsystems offers product development services with a focus on microelectronic package and assembly solutions. We have over 100 years of combined experience bringing your most complex microelectronic, optical, microfluidic or MEMS device to market in automotive, medical, industrial, telecom and consumer applications. Our experience in designing complete MEMS devices and fabrication processes, circuits and systems along with our software development and test capability allow us to provide a turn-key product development service for virtually any application. Our specialization in package design and development allows the most appropriate technologies to be employed and adapts proven solutions and qualified suppliers to meet your cost, size, performance, quality and time to market requirements. The four-phase “Aspen Design Process” utilizes a combination of analytic modeling and sophisticated multi-physics CAD tools to greatly enhance the success of initial prototypes and accelerate the transition to production. Our direct experience working with wafer foundries and assembly service providers from all corners of the world, along with our “Customer First” partnership model, assures you that the most appropriate technologies will be leveraged to bring even the most challenging products to market in the most cost effective and timely manner possible.

PRODUCT DESIGN & DEVELOPMENT

To be successful in today’s market, products must combine innovative design and well-timed technologies to create products that meet market needs. The four-step “Aspen Development Process” is a structured methodology that details the path from concept to production. This methodology was derived from decades of experience in successfully bringing a wide variety of cutting edge semiconductor-based products to market. Our practical experience in the design and development of MEMS devices, interface and calibration circuits, control systems, packages and housings, as well as complete turn-key products, provides your team with unique and critical skills that are not always readily available. We have experience with all levels of electrical, mechanical, optical, fluidic thermal and electromagnetic design and simulation and we use the most sophisticated tools, including SoftMEMS design suite, LEdit, and Solidworks, along with state of the art circuit design software to ensure the design meets specifications prior to expensive prototyping. Furthermore, our lack of exclusive relationships with service providers ensures that the most appropriate and cost-effective materials, technologies and manufacturing processes will be used throughout the design, prototype, development and manufacturing phases. Contact Aspen Microsystems to help you bring your MEMS-based product to market on-time and within budget.

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PACKAGE DESIGN & DEVELOPMENT

One of the most overlooked, yet most critical components in today’s MEMS and microelectronic, fluidic or optical devices is the package that houses the die and provides an interface to the system and the outside world. Since the package and assembly of a microelectronic device can be anywhere from 30% to 70% of the cost of the product, there is great opportunity to optimize a product’s cost structure through the use of appropriate package and assembly technologies. The engineers at Aspen Microsystems have developed hundreds of packages and assembly processes for dozens of different applications. We understand issues related to MEMS dicing, low-stress die attach, wirebond, flip chip, getter integration, sealing, molding and encapsulation. We have decades of experience with MEMS wafer-level packaging. We also have experience with ruggedizing your design for high temperature or high shock applications. Our CAD tools provide detailed mechanical, electrical, magnetic or fluidic analysis to ensure that interfaces to the system work as desired. Whether the product requires a high reliability hermetic package, a low cost plastic package, a wafer-scale package with TSVs, a microfluidic package, or an ultra-thin stacked die assembly, Aspen Microsystems can help your product development team bring their product to market.

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ASSEMBLY AND FABRIC PROCESSES

Elegant design combined with well-developed fabrication and package assembly processes result in products that perform well for the customer and meet internal business objectives. Aspen Microsystems has thorough knowledge of MEMS wafer fabrication processes, package assembly technologies as well as the equipment and materials used in those operations. Whether the need is to lower the cost of your internal operations, develop second sources or establish new supplier relationships, you can be assured that Aspen Microsystems’ “Customer First” strategy results in your needs being the only factor that influences supplier selection. Our direct experience with the wafer fabs, package assembly service providers, as well as equipment manufacturers ensures optimal solutions and it can have a direct benefit to your bottom line. The customer’s product and market needs drive the identification of the most appropriate technologies, which in turn drive the selection of the top candidate suppliers. We work with your quality and regulatory compliance staff to help qualify these suppliers according to your needs. From initial short loop experiments and feasibility builds, to prototypes through fully qualified processes that meet regulatory requirements, we can help you establish long-term, mutually beneficial relationships with the supply base.

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